Author: Grace

advanced printed circuit technology | additive manufacturing pcb | additive pcb | additive pcb manufacturing | advanced assembly pcb | advanced circuit board | advanced circuits 4pcb | advanced circuits assembly | advanced circuits barebones | advanced circuits flex pcb | advanced circuits pcb | advanced circuits pcb artist | advanced circuits quote | advanced pcb manufacturing | aerospace pcb assembly | aerospace pcb manufacturer | all flex circuits
Manufacturing method of PCB copper-clad laminate
ByGrace February 20, 2025February 19, 2025
PCB copper-clad laminate is the substrate material for making printed circuit boards. In addition to supporting various components, it can also achieve electrical connection or electrical insulation between them. The manufacturing process of PCB copper-clad laminate is to impregnate glass fiber cloth, glass fiber felt, paper and other reinforcing materials with adhesives such as epoxy…
Read More Manufacturing method of PCB copper-clad laminate
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A brief analysis of the influence of thixotropy on ink performance in PCB board making
ByGrace February 20, 2025February 19, 2025
A brief analysis of the influence of thixotropy on ink performance in PCB board making Core summary: The success or failure of ink use directly affects the overall technical requirements and quality indicators of PCB shipment. For this reason, PCB manufacturers attach great importance to the performance of ink. In addition to the well-known viscosity…
Read More A brief analysis of the influence of thixotropy on ink performance in PCB board making
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Advanced Topology for System-Level Test and PCB Configuration
ByGrace February 20, 2025February 19, 2025
The SELEX airborne radar discussed in this article uses a scalable design with a dynamically reconfigurable active backplane to serve multiple vector computing (VP) boards. Such a design can use the intelligent backplane to degrade service by shutting down the power to the suspect board when a board failure occurs. The main communication processor allows…
Read More Advanced Topology for System-Level Test and PCB Configuration
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Electromagnetic radiation detection technology in high-speed PCB design
ByGrace February 20, 2025February 19, 2025
Currently, most hardware engineers still design PCBs based on experience. During the debugging process, many signal lines or chip pins that need to be observed are buried in the middle layer of the PCB, and cannot be detected using tools such as oscilloscopes. If the product fails the functional test, they have no effective means…
Read More Electromagnetic radiation detection technology in high-speed PCB design
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Importance of electroplating to printed circuit boards
ByGrace February 20, 2025February 19, 2025
On printed circuit boards, copper is used to interconnect components on the substrate. Although it is a good conductor material for forming the conductive path pattern of the printed circuit board, it is easy to lose its luster due to oxidation and lose its solderability due to corrosion if exposed to air for a long…
Read More Importance of electroplating to printed circuit boards
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Dry film solder mask for printed circuit boards
ByGrace February 20, 2025February 19, 2025
Dry film solder mask is not in liquid or paste form, it appears in the form of a photosensitive polymer film, which is sandwiched between two protective layers. These two protective layers protect the middle photosensitive emulsion film to prevent it from being damaged during operation. The steps for applying dry film solder mask are…
Read More Dry film solder mask for printed circuit boards
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Hardware for digital image processing
ByGrace February 20, 2025February 19, 2025
The input component is a signal source for image processing. The quality of this signal will affect the overall processing effect. The most important problem is that the input device introduces noise. Therefore, any image processing system does a lot of work to remove this noise. For example, under the meteorological satellite receiving antenna, a…
Read More Hardware for digital image processing
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Circuit board reliability and micro-sectioning
ByGrace February 20, 2025February 19, 2025
Circuit board reliability and micro-sectioning 1.Abrasion Resistance In circuit board engineering, it often refers to the wear resistance of solder-proof green paint. The test method is to use a 1 kg soft grinding wheel to rotate and rub 50 times on the IP-B-25 sample board that has been painted green. The comb-shaped circuit area must…
Read More Circuit board reliability and micro-sectioning
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Introduction to the electrophoretic photoresist method for the production of MID three-dimensional substrates
ByGrace February 20, 2025February 19, 2025
Introduction to the electrophoretic photoresist method for the production of MID three-dimensional substrates I. MID three-dimensional substrates and traditional flat circuit boards PCB The design and manufacturing of electronic products are moving towards being thin, short and small, and circuit boards are also clearly developing towards fine lines and multi-layers. In terms of the control…
Read More Introduction to the electrophoretic photoresist method for the production of MID three-dimensional substrates
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High-speed FPGA-based PCB design technology
ByGrace February 20, 2025February 19, 2025
If the design contains a high-density FPGA, there are likely to be many challenges in front of the carefully designed schematic. Hundreds of inputs and outputs, operating frequencies exceeding 500MHz (and possibly higher in some designs), and solder ball pitches as small as half a millimeter all lead to unwanted interactions between design elements. Concurrent…
Read More High-speed FPGA-based PCB design technology
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Multilayer board lamination technology
ByGrace February 20, 2025February 19, 2025
In order to completely solve the problem of bubbles generated during the pressing of multilayer boards and improve the interlayer adhesion, the use of vacuum lamination technology is an inevitable trend. In terms of positioning technology, pinless positioning technology (MASSI.AM) has been widely used for 4-6 layer boards, and X-ray positioning drilling has been applied…
Read More Multilayer board lamination technology
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Five major categories of PCB substrates improve CCL technology level
ByGrace February 20, 2025February 19, 2025
The key tasks of my country’s copper clad laminate (CCL) industry in the future development strategy, specifically speaking, should be to work hard on five major categories of new PCB substrate materials, that is, through the development and technological breakthroughs of the five major categories of new substrate materials, to improve my country’s CCL cutting-edge…
Read More Five major categories of PCB substrates improve CCL technology level
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Five major categories of PCB substrates improve CCL technology level
ByGrace February 20, 2025February 19, 2025
The key tasks of my country’s copper clad laminate (CCL) industry in the future development strategy, specifically speaking, should be to work hard on five major categories of new PCB substrate materials, that is, through the development and technological breakthroughs of the five major categories of new substrate materials, to improve my country’s CCL cutting-edge…
Read More Five major categories of PCB substrates improve CCL technology level
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PCB anti-interference design principles you don’t know
ByGrace February 19, 2025February 18, 2025
Anti-interference is a very important part of modern PCB circuit design, which directly reflects the performance and reliability of the entire system. At present, the anti-interference technologies used in the system mainly include hardware anti-interference technology and software anti-interference technology. 1) Design of hardware anti-interference technology. The inverter circuit of the flywheel energy storage system…
Read More PCB anti-interference design principles you don’t know
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Factors Affecting PCB DK and Phase Consistency
ByGrace February 19, 2025February 18, 2025
As frequencies continue to increase, controlling the phase consistency of PCB materials becomes increasingly difficult. Accurately predicting the phase change of PCB materials is not a simple or routine task. The signal phase of high-frequency and high-speed PCBs depends largely on the structure of the transmission lines made from them, as well as the dielectric…
Read More Factors Affecting PCB DK and Phase Consistency

Author: Grace

Manufacturing method of PCB copper-clad laminate

A brief analysis of the influence of thixotropy on ink performance in PCB board making

Advanced Topology for System-Level Test and PCB Configuration

Electromagnetic radiation detection technology in high-speed PCB design

Importance of electroplating to printed circuit boards

Dry film solder mask for printed circuit boards

Hardware for digital image processing

Circuit board reliability and micro-sectioning

Introduction to the electrophoretic photoresist method for the production of MID three-dimensional substrates

High-speed FPGA-based PCB design technology

Multilayer board lamination technology

Five major categories of PCB substrates improve CCL technology level

Five major categories of PCB substrates improve CCL technology level

PCB anti-interference design principles you don’t know

Factors Affecting PCB DK and Phase Consistency

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