TC350™ Plus laminates are ceramic filled PTFE-based woven glass reinforcedcomposite materials providing a cost effective, high performance, thermallyenhanced material for the circuit designer. With a thermal conductivity of 1.24W/mK, this next generation PTFE-based laminate is ideally suited for higher powermicrowave and industrial heating applications requiring higher maximum operatingtemperatures, low circuit losses, and excellent thermal dissipation…
TC350™ fiberglass reinforced, ceramic-filled, PTFE-based composite for printedcircuit board substrates, offers outstanding thermal conductivity to enhanceheat transfer, thereby reducing dielectric and insertion loss. This leads tohigher gains and efficiencies in amplifiers and antennas. Its increased thermalconductivity handles higher power, reduces hot-spots, and boosts devicereliability. TC350 laminates are effective in designs with limited thermalmanagement, improving heat…
Rogers CU4000™ foil is intended for MLB designs using RO4000® cores and prepreg materials requiring foil bonded outer layers. CU4000 ED foil is a highperformance single side treated electrodeposited copper foil with increasedmechanical bonding area designed to provide high peel strength on RO4400™series prepregs. All CU4000 LoPro® foil is reverse treated electrodepositedcopper foil. This uses…
RO4835T™ laminates are 3.3 Dk low loss, spread glass reinforced, ceramicthermoset materials that were designed as inner-layers for use in multilayerboard designs, and to complement RO4835™ laminates when thinner cores areneeded. The world has seen the ongoing evolution of mobile networks, GSM, WCDMAand LTE that has enabled users to grow data consumption at amazing ratesand…
Thermoset laminate materials, including FR-4, are affected by oxidation overtime and temperature. This can slightly increase the dielectric constant anddissipation factor of the circuit substrate. The change rate and impact oncircuit performance vary based on design and operating temperature. Rogers’RO4835™ laminate, part of the RO4000® series, offers enhanced stability athigh temperatures and is more resistant…
RO4830™ thermoset laminates are well suited for price-sensitive millimeter waveapplications, such as 76-81 GHz automotive radar sensors, and are a reliable, lowercost alternative to conventional PTFE-based laminates. RO4830 laminates have aslightly higher dielectric constant of 3.2 at 77GHz, versus PTFE-woven glass laminates.LoPro® reverse treated copper foil cladding contributes to RO4830 laminates’ excellentinsertion loss at 77GHZ…
RO4700™ series antenna grade laminates are a reliable alternative to the conventional PTFEbased laminates. RO4725JXR™ and RO4730G3(TM) laminates have the mechanical and electrical properties thatantenna designers need. The laminates have a dielectric constant (Dk) of 2.55 and 3.0 and a losstangent (Df) of 0.0022 measured at 2.5 GHz when using LoPro® Reverse Treated EDC Foil….
RO4500™ Series High Frequency Laminates are cost/performance materials from RogersCorporation, specifically engineered and manufactured to meet the specific demands ofthe antenna markets. RO4533™, RO4534™, and RO4535™ laminates extend the capabilities of the successfulRO4000® product series into antenna applications. This ceramic-filled, glass-reinforcedhydrocarbon based material set provides the controlled dielectric constant, low lossperformance and excellent passive intermodulation…
The RO4400™ bondply family is comprised of several gradesbased on the RO4000 series core materials, and are compatiblein multi-layer constructions with RO4000 laminates. A highpostcure Tg makes RO4400 series bondply an excellent choice formulti-layers requiring sequential laminations as fully cured RO4400bondplys are capable of handling multiple lamination cycles. Inaddition, FR-4 compatible bond requirements permit RO4400bondply…
RO4360G2™ laminates are 6.15 Dk, low loss, glass-reinforced,hydrocarbon ceramic-filled thermoset materials that provide the idealbalance of performance and processing ease. RO4360G2 laminatesextend Rogers’ portfolio of high performance materials by providingcustomers with a product that is lead-free process capable andoffers better rigidity for improved processability in multi-layer boardconstructions, while reducing material and fabrication costs. RO4360G2 laminates…
RT duroid 6202PR high frequency circuit material is a low loss and low dielectricconstant laminate offering superior electrical and mechanical properties essentialin designing complex microwave structures which are mechanically reliable andelectrically stable and used for planar resistor applications. Excellent dimensional stability (0.05 to 0.07 mils/inch) is achieved by the addition oflimited woven glass reinforcement. This…
RT duroid 6202 high frequency circuit material is alow loss and low dielectric constant laminate offeringsuperior electrical and mechanical properties essentialin designing complex microwave structures which aremechanically reliable and electrically stable. Excellent dimensional stability (0.05 to 0.07 mils/inch)is achieved by the addition of limited woven glassreinforcement. This often eliminates double etching toachieve tight positional tolerances….
RTduroid 6035HTC high frequency circuit materials are ceramic filled PTFE composites foruse in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, andcopper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RTduroid 6035HTC laminates are an exceptional choice for high power applications….
RT/duroid 6006/6010LM microwave laminates are ceramicPTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15 and RT/duroid 6010LM laminate has a dielectric constant of 10.2. RT/duroid 6006/6010LM microwave laminates feature ease of fabrication and stability in use. They have…
Rogers RT/duroid 6002 microwave material was the first low loss and low dielectric constant laminate tooffer superior electrical and mechanical properties essential in designing complex microwave structureswhich are mechanically reliable and electrically stable. The thermal coefficient of dielectric constant is extremely low from -55oC to+150oC (-67°F to 302°F) whichprovides the designers of filters, oscillators and…