1, the splicing method: Applicable: the film with less dense lines and inconsistent deformation of the film layers; it is especially suitable for the deformation of the solder mask and multilayer power supply ground film; Not applicable: negative film with high wire density, line width and spacing less than 0.2mm; Note: When cutting, try to…
PCB circuit board soldering and blistering means that the circuit board is separated from the board or copper foil in a high temperature environment (above 250 °C), so that the solder resist and the flow blocking effect are lost. The occurrence of solder mask blistering on the PCB circuit board not only affects the appearance…
Let us first introduce the common holes in the PCB: through holes, blind holes, buried holes. The meaning and characteristics of these three holes. Via (VIA), a common hole used to turn on or connect copper foil traces between conductive patterns in different layers of a board. For example (such as blind holes, buried holes),…
Circuit board assembly technology, now popular in the industry is full-board reflow soldering (Reflow), this technology can be divided into single-panel reflow and double-panel reflow. Single-sided reflow is used less because double-sided reflow saves board space. Double-sided reflow requires two reflows. Because of the limitations of the process, some problems may occur. For example, when…
1. The test points must be added to the components of the chip components that are not connected to the plug-in components. The diameter of the test points is between 1.0mm and 1.5mm, which is convenient for online tester testing. The edge of the test pad is at least 0.4 mm from the edge of…
The circuit board is made up of a layer of copper foil circuits, and the communication between the different circuit layers depends on the vias. This is because today’s circuit boards are manufactured using drill holes to connect to different circuits. The purpose of the layer, the connection is to conduct electricity, so it is…
Based on our past experience, I would like to talk about my views on the following aspects: To clarify design goals To receive a design task, first of all to clarify its design goals, is the ordinary PCB board high-frequency PCB board small signal processing PCB board or PCB with high frequency and small signal…
The process of printing a printed circuit board from the light board to the display of the line pattern is a relatively complicated process of physical and chemical reactions. This article analyzes the final step, etching. Currently, typical processes for printed circuit board (PCB) processing use pattern plating. That is, a layer of lead-tin resist…
Printed circuit board (PCB) design is the process of designing schematics, laying out circuits, and producing the circuit board at the lowest possible cost. In the past, this was usually done with expensive, dedicated tools, but now, with the increasing availability of free, high-performance software tools – such as DesignSpark PCB – and design models,…
1.PCB pads PCB pads: Components are fixed to the PCB through the lead holes on the PCB with solder, and the printed wires connect the pads to achieve electrical connection of the components in the circuit. The lead holes and the surrounding copper foil are called pads. Types of PCB pads include: Square pads –…
(1) Why use gold-plated plates? As ICs become more integrated, the IC pins are more dense. The vertical tin-spraying process is difficult to flatten the fine pads, which makes the placement of the SMT difficult; in addition, the shelf life of the tin-plate is very short. The gold-plated plate solves these problems: 1 For the…
1. Dry film masking holes appear broken Many customers believe that after the occurrence of broken holes, the film temperature and pressure should be increased to enhance the bonding force. In fact, this view is incorrect. Because the temperature and pressure are too high, the solvent of the resist is excessively volatilized and dried. The…
Let us first introduce the common holes in the PCB: through holes, blind holes, buried holes. The meaning and characteristics of these three holes. Via (VIA), a common hole used to turn on or connect copper foil traces between conductive patterns in different layers of a board. For example (such as blind holes, buried holes),…
Process characteristics of selective welding The process characteristics of selective soldering can be understood by comparison with wave soldering. The most obvious difference between the two is that the lower part of the pcb in the wave soldering is completely immersed in the liquid solder, while in the selective soldering, only a certain specific area…
The heat generated during the operation of the electronic device causes the internal temperature of the device to rise rapidly. If the heat is not dissipated in time, the device will continue to heat up, and the device will fail due to overheating, and the reliability of the electronic device will decrease. Therefore, it is…
We use cookies to improve your experience on our site. By using our site, you consent to cookies.
Manage your cookie preferences below:
Essential cookies enable basic functions and are necessary for the proper function of the website.
Statistics cookies collect information anonymously. This information helps us understand how visitors use our website.
Google Analytics is a powerful tool that tracks and analyzes website traffic for informed marketing decisions.
Service URL: policies.google.com (opens in a new window)
SourceBuster is used by WooCommerce for order attribution based on user source.
You can find more information in our privacy policy and privacy policy.