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Design performance requirements for multi-substrates
ByGrace February 8, 2025February 7, 2025
Most of the design performance of multi-substrates is similar to that of single or dual substrates, that is, to avoid cramming too many circuits into too small a space, which results in unrealistic tolerances, high inner layer capacitance, and even possible safety compromises to product quality. Therefore, performance specifications should consider a complete evaluation of…
Read More Design performance requirements for multi-substrates
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About Flip Chip Assembly on Flexible Circuit Boards
ByGrace February 8, 2025February 7, 2025
The ability to control machines with thoughts is a long-standing dream; especially for those who are paralyzed. In recent years, technological advances have accelerated the progress of brain-machine interfaces (BMI). For biomedical applications, Duke University researchers have successfully developed ASICs for signal processing and electronic circuit systems for wireless transmission of power and information using…
Read More About Flip Chip Assembly on Flexible Circuit Boards
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Composition of online tester module for double-sided PCB
ByGrace February 8, 2025February 7, 2025
I. Circuit online test technology In order to ensure the functional test of the device on the circuit board, the logic level of the drive device must be forced, and each pin driver must be able to absorb or output sufficient current. According to the post-drive safety standard recommended by the international protection standard document…
Read More Composition of online tester module for double-sided PCB
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Protective coating for printed circuit boards
ByGrace February 8, 2025February 7, 2025
Protective coating is used to enhance the performance and reliability of printed circuit board assemblies, enabling them to be used in harsh environments such as underwater, aerospace and military applications. Manufacturers of consumer electronics are increasingly using protective coatings as an economical way to improve product reliability. When a printed circuit assembly board without protective…
Read More Protective coating for printed circuit boards
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Anti-interference considerations for digital circuit design
ByGrace February 7, 2025February 6, 2025
In the design of electronic systems, in order to avoid detours and save time, the requirements for anti-interference should be fully considered and met to avoid taking remedial measures for anti-interference after the design is completed. There are three basic elements that form interference: (1) Interference source, which refers to the components, equipment or signals…
Read More Anti-interference considerations for digital circuit design
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Two key processes for PCB rework
ByGrace February 7, 2025February 6, 2025
The two most critical processes that help successfully rework SMT are also the two most easily overlooked issues: Appropriate preheating of the PCB before reflow; 1.Quick cooling of the solder joints after reflow. Since these two fundamental processes are often overlooked by rework technicians, in fact, sometimes the condition after rework is worse than before…
Read More Two key processes for PCB rework
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Differences and usages of Fill, Polygon Pour, and Plane in Altium
ByGrace February 7, 2025February 6, 2025
Fill means drawing a solid copper sheet, connecting all the connections and vias in the area together, regardless of whether they belong to the same network. If there are two networks, VCC and GND, in the drawn area, the Fill command will connect the elements of these two networks together, which may cause a short…
Read More Differences and usages of Fill, Polygon Pour, and Plane in Altium
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PCB Cooling Technology and Heat Dissipation of IC Packages
ByGrace February 7, 2025February 6, 2025
IC packages rely on PCBs to dissipate heat. Generally speaking, PCBs are the primary cooling method for high-power semiconductor devices. A good PCB thermal design can have a huge impact on the system’s good operation or the potential for thermal accidents. Careful handling of PCB layout, board structure, and device mounting can help improve the…
Read More PCB Cooling Technology and Heat Dissipation of IC Packages
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Design skills and key points for efficient automatic wiring of PCB
ByGrace February 7, 2025February 6, 2025
Although the current EDA tools are very powerful, as the PCB size requirements are getting smaller and smaller and the device density is getting higher and higher, the difficulty of PCB design is not small. How to achieve a high PCB routing rate and shorten the design time? This article introduces the design skills and…
Read More Design skills and key points for efficient automatic wiring of PCB
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A PCB anti-interference design technology for high-speed DSP
ByGrace February 7, 2025February 7, 2025
In recent years, with the rapid development of new processes and new devices, high-speed devices have become more and more popular, and high-speed circuit design has become a commonly needed technology. TI’s DSPs chip TMS320C62xx, C64xx, and C67xx series devices are one of the rapidly developing high-speed devices. The internal structure of C6000 is fixed-point,…
Read More A PCB anti-interference design technology for high-speed DSP
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Practical problems in the production of fine lines on circuit boards
ByGrace February 7, 2025February 7, 2025
With the development of the electronics industry, the integration of electronic components is getting higher and higher, while the size is getting smaller and smaller, and BGA type packaging is widely used. Therefore, the lines of PCBs will become smaller and smaller, and the number of layers will increase. Reducing the line width and line…
Read More Practical problems in the production of fine lines on circuit boards
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RF circuit PCB design
ByGrace February 7, 2025February 7, 2025
With the development of communication technology, handheld wireless RF circuit technology is increasingly used, such as wireless pagers, mobile phones, wireless PDAs, etc. The performance indicators of the RF circuits directly affect the quality of the entire product. One of the biggest features of these handheld products is miniaturization, and miniaturization means that the density…
Read More RF circuit PCB design
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Good Grounding Guidelines for PCB Design
ByGrace February 7, 2025February 7, 2025
Grounding is undoubtedly one of the most difficult issues in system design. Although it is relatively simple in concept, it is complex to implement. Unfortunately, there is no concise, step-by-step method to ensure good results, but if some details are not handled correctly, they can cause headaches. “ground” is the reference point for signals. For…
Read More Good Grounding Guidelines for PCB Design
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Physical recycling and comprehensive utilization technology of waste PCB
ByGrace February 6, 2025February 5, 2025
Circuit board design steps Generally speaking, the most basic process of designing a circuit board can be divided into three steps. (1)Design of circuit schematic: The design of circuit schematic mainly uses the schematic design system (Advanced Schematic) of PROTEL099 to draw a circuit schematic. In this process, we should make full use of the…
Read More Physical recycling and comprehensive utilization technology of waste PCB
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Master the characteristics of IC packaging to achieve optimal EMI suppression performance
ByGrace February 6, 2025February 6, 2025
Placing decoupling capacitors directly inside the IC package can effectively control EMI and improve signal integrity. This article starts with the internal packaging of the IC, analyzes the source of EMI, the role of IC packaging in EMI control, and then proposes 11 design rules for effective EMI control, including package selection, pin structure considerations,…
Read More Master the characteristics of IC packaging to achieve optimal EMI suppression performance

additive pcb

Design performance requirements for multi-substrates

About Flip Chip Assembly on Flexible Circuit Boards

Composition of online tester module for double-sided PCB

Protective coating for printed circuit boards

Anti-interference considerations for digital circuit design

Two key processes for PCB rework

Differences and usages of Fill, Polygon Pour, and Plane in Altium

PCB Cooling Technology and Heat Dissipation of IC Packages

Design skills and key points for efficient automatic wiring of PCB

A PCB anti-interference design technology for high-speed DSP

Practical problems in the production of fine lines on circuit boards

RF circuit PCB design

Good Grounding Guidelines for PCB Design

Physical recycling and comprehensive utilization technology of waste PCB

Master the characteristics of IC packaging to achieve optimal EMI suppression performance

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