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PCB circuit board heat treatment points
ByGrace November 26, 2024November 25, 2024
The heat generated during the operation of the electronic device causes the internal temperature of the device to rise rapidly. If the heat is not dissipated in time, the device will continue to heat up and the device will fail due to overheating, and the reliability of the electronic device will decrease. Therefore, it is…
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Five Methods for Reliability Design of Printed Circuit Boards
ByGrace November 26, 2024November 25, 2024
First, ground design In electronic equipment, grounding is an important method to control interference If you can use the correct combination of grounding and shielding, you can solve most of the interference problems. The ground structure of the electronic device is roughly systematic, chassis ground (shielded ground), digital ground (logical ground), and analog ground. The…
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FPC surface plating process
ByGrace November 26, 2024November 22, 2024
1. FPC plating (1) Pre-treatment of FPC electroplating After the FPC of the flexible printed circuit board is covered with a coating, the surface of the exposed copper conductor may be contaminated with an adhesive or ink, and oxidation and discoloration due to a high-temperature process may occur. A tightly adherent, tight coating must remove…
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Printed circuit board plating production line maintenance and maintenance
ByGrace November 26, 2024November 25, 2024
Printed circuit board plating production line maintenance and maintenance In the production process of printed circuit boards, there are mainly two kinds of electroplating equipment, one is a horizontal electroplating line and the other is a vertical electroplating line. The electroplating equipment of these two different structures is mainly different in the transportation mode of…
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Resistance – Thick Film Resistor Vulcanization
ByGrace November 26, 2024November 23, 2024
A group of field instruments used in a chemical plant a year later, the instrument has failed. The analysis found that the instrument used in the thick film patch resistance has become larger, and even become open. The failure of the resistance observed under a microscope, you can find the edges of the resistance electrode…
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High-frequency circuit design and wiring is the key to share ten experiences!
ByGrace November 26, 2024November 23, 2024
If the digital logic circuit frequency reaches or exceeds 45MHZ ~ 50MHZ, and work in this frequency circuit has accounted for a certain amount of the entire electronic system (for example, 1/3), usually called high-frequency circuit. High-frequency circuit design is a very complex design process, the layout of the entire design is crucial! [The first…
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PCB circuit board layer full resolution
ByGrace November 26, 2024November 25, 2024
PCB design If you need to connect multiple boards to a larger system and provide interconnections between them, you may use a backplane to arrange and cascade these boards. The backplane is an advanced board, which borrows some elements from high-speed design, mechanical design, high-voltage/high-current design and even RF design. These boards are commonly used…
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Hot air leveling process exposed copper analysis
ByGrace November 25, 2024November 22, 2024
Hot air leveling involves immersing the printed circuit board in molten solder (63SN/37PB) and then blowing hot air over the surface of the printed circuit board and the excess solder in the metalized hole to obtain a smooth, uniform, and bright solder coating. Cladding. After the hot air leveling, the surface of the tin-alloy coating…
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Flexible CCL Application Note
ByGrace November 25, 2024November 22, 2024
First, protective coating of flexible copper clad laminate The protective cover is a permanent insulating film or a coating covering the conductor side of the flexible printed circuit (of course, no protective coating is required at the pad). This protective coating prevents the circuit from moisture, contamination and Other forms of damage, at the same…
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Problems with PCBs in PCB Design and Solutions
ByGrace November 25, 2024November 25, 2024
The following problems may be caused by the substrate in the PCB design process: First, all kinds of soldering problems Now symbol mega: cold solder joints or solder joints have blast holes. Inspection method: The hole is frequently dissected before dip soldering and after dip soldering to find out where the copper is stressed. In…
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PCB circuit anti-jamming measures
ByGrace November 25, 2024November 22, 2024
In the design of electronic systems, in order to avoid detours and save time, the requirements of anti-interference should be fully considered and satisfied, and remedial measures against interference should be avoided after the design is completed. There are three basic elements of interference: (1) Interference source refers to the component, device or signal that…
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Classification of electroplating process Process flow and description
ByGrace November 25, 2024November 22, 2024
1, Autoclave pressure cooker It is a kind of container filled with high-temperature saturated water vapor, which can apply high pressure. It can place laminated Laminates samples for a period of time to force water vapor into the plate and then remove the plate sample. Placed on a high-temperature molten tin surface, its “delamination-resistant” properties…
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Multilayer Laminating Process Glossary
ByGrace November 25, 2024November 22, 2024
1, Autoclave pressure cooker It is a kind of container filled with high-temperature saturated water vapor, which can apply high pressure. It can place laminated Laminates samples for a period of time to force water vapor into the plate and then remove the plate sample. Placed on a high-temperature molten tin surface, its “delamination-resistant” properties…
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Gold finger gold plating quality problems and measures
ByGrace November 25, 2024November 22, 2024
1 Introduction In connector plating, due to the high electrical performance requirements of the contact pairs, the gold plating process occupies a significant position in the connector plating. At present, except for some of the ribbon connectors using selective gold plating process, the rest of the needles The gold plating in the hole of the…
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Key Process Improvements for High-precision Printed Wiring Boards
ByGrace November 25, 2024November 22, 2024
Six ways to reduce automotive PCB defect rate The automotive electronics market is the third largest application area for PCBs after computers and communications. With the traditional mechanical products of automobiles, they gradually evolved and developed into high-tech products that integrate intelligence, information, and mechatronics. Electronic technology has been widely used in automobiles, both as…
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