DBC Ceramic: A Comprehensive Overview of Direct Bonded Copper Technology
Introduction Direct Bonded Copper (DBC) ceramic substrates are a critical component in modern electronics, particularly in high-power and high-temperature applications. DBC technology involves bonding a layer of copper directly onto a ceramic substrate, typically alumina (Al₂O₃) or aluminum nitride (AlN), to create a robust and thermally efficient material. This combination of materials provides excellent electrical…














