advanced circuits barebones

The chip on board (COB) process first covers the silicon wafer placement point on the substrate surface with thermal conductive epoxy resin (generally epoxy resin doped with silver particles), then directly places the silicon wafer on the substrate surface, heat treats until the silicon wafer is firmly fixed on the substrate, and then uses wire…

I. Circuit online test technology In order to ensure the functional test of the device on the circuit board, the logic level of the drive device must be forced, and each pin driver must be able to absorb or output sufficient current. According to the post-drive safety standard recommended by the international protection standard document…