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Introduction Copper cladding, also known as copper pour or copper fill, is a fundamental aspect of Printed Circuit Board (PCB) design. It involves the strategic placement of copper areas on the PCB to enhance electrical performance, thermal management, and mechanical stability. This article delves into the significance of copper cladding, its various techniques, and best…

Introduction In the world of electronics manufacturing, the terms PCB (Printed Circuit Board) and PCBA (Printed Circuit Board Assembly) are often used interchangeably, but they refer to distinct stages in the production process. Understanding the difference between PCB and PCBA is crucial for anyone involved in electronics design, manufacturing, or procurement. This article will delve…