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Reasons for choosing lead-free tin wire
ByGrace February 21, 2025February 20, 2025
Tin wire is one of the welding materials for electronic products, and tin wire is divided into lead tin wire and lead-free tin wire. The price of lead-free tin wire is much higher than that of lead tin wire, which will greatly increase the cost of welding materials. Why should automatic soldering machine merchants choose…
Read More Reasons for choosing lead-free tin wire
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Manufacturing method of PCB copper-clad laminate
ByGrace February 20, 2025February 19, 2025
PCB copper-clad laminate is the substrate material for making printed circuit boards. In addition to supporting various components, it can also achieve electrical connection or electrical insulation between them. The manufacturing process of PCB copper-clad laminate is to impregnate glass fiber cloth, glass fiber felt, paper and other reinforcing materials with adhesives such as epoxy…
Read More Manufacturing method of PCB copper-clad laminate
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A brief analysis of the influence of thixotropy on ink performance in PCB board making
ByGrace February 20, 2025February 19, 2025
A brief analysis of the influence of thixotropy on ink performance in PCB board making Core summary: The success or failure of ink use directly affects the overall technical requirements and quality indicators of PCB shipment. For this reason, PCB manufacturers attach great importance to the performance of ink. In addition to the well-known viscosity…
Read More A brief analysis of the influence of thixotropy on ink performance in PCB board making
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Advanced Topology for System-Level Test and PCB Configuration
ByGrace February 20, 2025February 19, 2025
The SELEX airborne radar discussed in this article uses a scalable design with a dynamically reconfigurable active backplane to serve multiple vector computing (VP) boards. Such a design can use the intelligent backplane to degrade service by shutting down the power to the suspect board when a board failure occurs. The main communication processor allows…
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Circuit board reliability and micro-sectioning
ByGrace February 20, 2025February 19, 2025
Circuit board reliability and micro-sectioning 1.Abrasion Resistance In circuit board engineering, it often refers to the wear resistance of solder-proof green paint. The test method is to use a 1 kg soft grinding wheel to rotate and rub 50 times on the IP-B-25 sample board that has been painted green. The comb-shaped circuit area must…
Read More Circuit board reliability and micro-sectioning
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Introduction to the electrophoretic photoresist method for the production of MID three-dimensional substrates
ByGrace February 20, 2025February 19, 2025
Introduction to the electrophoretic photoresist method for the production of MID three-dimensional substrates I. MID three-dimensional substrates and traditional flat circuit boards PCB The design and manufacturing of electronic products are moving towards being thin, short and small, and circuit boards are also clearly developing towards fine lines and multi-layers. In terms of the control…
Read More Introduction to the electrophoretic photoresist method for the production of MID three-dimensional substrates
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High-speed FPGA-based PCB design technology
ByGrace February 20, 2025February 19, 2025
If the design contains a high-density FPGA, there are likely to be many challenges in front of the carefully designed schematic. Hundreds of inputs and outputs, operating frequencies exceeding 500MHz (and possibly higher in some designs), and solder ball pitches as small as half a millimeter all lead to unwanted interactions between design elements. Concurrent…
Read More High-speed FPGA-based PCB design technology
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Multilayer board lamination technology
ByGrace February 20, 2025February 19, 2025
In order to completely solve the problem of bubbles generated during the pressing of multilayer boards and improve the interlayer adhesion, the use of vacuum lamination technology is an inevitable trend. In terms of positioning technology, pinless positioning technology (MASSI.AM) has been widely used for 4-6 layer boards, and X-ray positioning drilling has been applied…
Read More Multilayer board lamination technology
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Five major categories of PCB substrates improve CCL technology level
ByGrace February 20, 2025February 19, 2025
The key tasks of my country’s copper clad laminate (CCL) industry in the future development strategy, specifically speaking, should be to work hard on five major categories of new PCB substrate materials, that is, through the development and technological breakthroughs of the five major categories of new substrate materials, to improve my country’s CCL cutting-edge…
Read More Five major categories of PCB substrates improve CCL technology level
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Five major categories of PCB substrates improve CCL technology level
ByGrace February 20, 2025February 19, 2025
The key tasks of my country’s copper clad laminate (CCL) industry in the future development strategy, specifically speaking, should be to work hard on five major categories of new PCB substrate materials, that is, through the development and technological breakthroughs of the five major categories of new substrate materials, to improve my country’s CCL cutting-edge…
Read More Five major categories of PCB substrates improve CCL technology level
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Factors Affecting PCB DK and Phase Consistency
ByGrace February 19, 2025February 18, 2025
As frequencies continue to increase, controlling the phase consistency of PCB materials becomes increasingly difficult. Accurately predicting the phase change of PCB materials is not a simple or routine task. The signal phase of high-frequency and high-speed PCBs depends largely on the structure of the transmission lines made from them, as well as the dielectric…
Read More Factors Affecting PCB DK and Phase Consistency
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Hardware Design Practice FPC Flexible Circuit Board Design Guide
ByGrace February 19, 2025February 18, 2025
Flexible Printed Circuit (FPC Flexible Printed Circuit) is a circuit form made on a flexible surface, which can have a cover layer or not (usually used to protect the FPC circuit). Since FPC flexible circuit boards can be bent, folded or repeated in a variety of ways, they have the advantages of being light, thin…
Read More Hardware Design Practice FPC Flexible Circuit Board Design Guide
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Seven tricks for the design of PCB boards for switching power supplies
ByGrace February 19, 2025February 18, 2025
The design of PCB boards for stable working of switching power supplies now summarizes seven tricks: by analyzing the matters that need to be paid attention to in each step, you can easily design the PCB board step by step! 1.Design process from schematic diagram to PCB Establish component parameters-》Enter principle netlist-》Design parameter setting-》Manual layout-》Manual…
Read More Seven tricks for the design of PCB boards for switching power supplies
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Technical Engineer Shares: Why PCB Design Needs 3D Capabilities?
ByGrace February 19, 2025February 18, 2025
Designing and building the next generation of electronic products is a complex process, especially in a highly competitive global industry like the electronics industry, where rapid and continuous technological changes have become a common occurrence and the rule of innovation. If designers cannot accept these changes, they will face the risk of being left behind…
Read More Technical Engineer Shares: Why PCB Design Needs 3D Capabilities?
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Five major PCB design problems and solutions
ByGrace February 19, 2025February 18, 2025
The 20H principle refers to the power layer being retracted 20H relative to the ground layer. H represents the distance between the power layer and the ground layer, and of course it is also to suppress the edge radiation effect. Electromagnetic interference will be radiated outward at the edge of the board – the power…
Read More Five major PCB design problems and solutions

advanced circuits quote

Reasons for choosing lead-free tin wire

Manufacturing method of PCB copper-clad laminate

A brief analysis of the influence of thixotropy on ink performance in PCB board making

Advanced Topology for System-Level Test and PCB Configuration

Circuit board reliability and micro-sectioning

Introduction to the electrophoretic photoresist method for the production of MID three-dimensional substrates

High-speed FPGA-based PCB design technology

Multilayer board lamination technology

Five major categories of PCB substrates improve CCL technology level

Five major categories of PCB substrates improve CCL technology level

Factors Affecting PCB DK and Phase Consistency

Hardware Design Practice FPC Flexible Circuit Board Design Guide

Seven tricks for the design of PCB boards for switching power supplies

Technical Engineer Shares: Why PCB Design Needs 3D Capabilities?

Five major PCB design problems and solutions

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