Andwin PCB Blog
CB multilayer board is a circuit board composed of multiple conductive layers and insulating layers stacked alternately, which is widely used in various complex electronic devices. Below we will analyze the advantages and disadvantages of PCB multilayer boards from multiple aspects. 1.Advantages of PCB multilayer board High-density integration capability PCB multilayer board allows for higher…
Formation of peak current: The current Ioh pulled from the power supply when the digital circuit outputs a high level and the current Iol injected when the digital circuit outputs a low level are generally different, that is: Iol＞Ioh. Take the TTL NAND gate in the following figure as an example to illustrate the formation…
The results of the eye diagram also show that the effect is obvious. In fact, in the process of product design, PCB wiring is often not something you can modify as you want, which involves collaboration between many aspects and departments; changing PCB materials is also very troublesome, and it can only be adjusted after…
Letting machines replace people to work is a main theme of human social development, and efforts and attempts around this vision have never stopped. In the second half of the 20th century, people introduced the concept of “automation” in industrial manufacturing, that is, using various technologies, methods and tools to minimize human intervention in the…
When you need to replace ICs in PCB circuit design, here are some tips for replacing ICs to help designers design PCB circuits more perfectly. 1.Direct replacement Direct replacement means replacing the original IC with another IC without any modification, and the replacement does not affect the main performance and indicators of the machine. The…
If the interlayer capacitance is not large enough, the electric field will be distributed over a relatively large area of the board, so that the interlayer impedance is reduced and the return current can flow back to the top layer. In this case, the field generated by this signal may interfere with the field of…
1.Manufacturing technology and structural characteristics HDI board: It is manufactured by the build-up method, and the technical level of the board is improved by continuously increasing the number of build-up layers. A large number of micro-blind buried hole technology is used, and the hole diameter is less than 150um, which improves the assembly density and…
In the application of 65W~150W output power range, CrM PFC+QR Flyback topology is a very commonly selected architecture. Under the trend of miniaturized integrated circuits, QR combo control chips came into being. In addition, for consumer electronic products, not only does energy efficiency need to meet regulatory requirements, but its standby loss is also a…
In the circuit, electronic components are divided into strong and weak. The ranking of electronic components’ resistance is as follows: Resistors, inductors, capacitors, semiconductor devices (including diodes, triodes, field tubes, integrated circuits). That is to say, under the same working conditions, semiconductor devices have the highest probability of damage. When looking for faulty components, diodes,…
DFM: Design for Manufacture DFM means design for manufacturing, Design for manufacturability, that is, starting from improving the manufacturability of parts, making parts and various processes easy to manufacture, low manufacturing cost, high efficiency, and low cost ratio. It is to fully consider the difficulties that may be encountered in the production link during the…
“Grounding” generally refers to connecting a circuit, device or system to a good conductor that serves as a reference potential point or reference potential surface, so as to establish a low-impedance channel between the circuit or system and the “ground”. The ground wire is an equipotential body that serves as the potential reference point of…
1.Familiarity with factory manufacturing processes In this era of fabless IC companies, it is not surprising that many engineers are not aware of the production steps and chemical treatment processes for PCBs manufactured based on their design files. However, this lack of practical knowledge often leads novice engineers to make unnecessary and more complex design…
1 Layer distribution （1） Double-layer board, the top layer is the signal layer, the bottom layer is the ground plane. （2） Four-layer board, the top layer is the signal layer, the second layer is the ground plane, and the third layer is the power supply and control line. In special cases (such as RF signal…
1.Definition of signal integrity: Definition: Signal integrity (SI) refers to the quality of the signal on the signal line. Poor signal integrity is not caused by a single factor, but by multiple factors in board-level design. When the signal in the circuit can reach the receiving end with the required timing, duration and voltage amplitude,…
To buy Rogers PCB material, follow these steps: 1. Determine the specific product and grade of Rogers PCB material you need for your application. This information can be found in the datasheet or by consulting with an engineer. 2. Search for electronic component suppliers and distributors that carry Rogers PCB material. Popular suppliers include Mouser…