Rogers RT duroid 6002 PCB raw material

Rogers RT/duroid 6002 microwave material was the first low loss and low dielectric constant laminate to
offer superior electrical and mechanical properties essential in designing complex microwave structures
which are mechanically reliable and electrically stable.

The thermal coefficient of dielectric constant is extremely low from -55oC to+150oC (-67°F to 302°F) which
provides the designers of filters, oscillators and delay lines the electrical stability needed in today’s
demanding applications.

A low Z axis coefficient of thermal expansion (CTE) ensures excellent reliability of plated through-holes.
Rogers RT/duroid 6002 materials have been successfully temperature cycled (-55oC to 125oC [-67°F to
257°F]) for over 5000 cycles without a single via failure.

Rogers RT duroid 6002 pcb

Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y coefficient of
expansion to copper. This often eliminates double etching to achieve tight positional tolerances.

The low tensile modulus (X,Y) greatly reduces the stress applied to solder joints and allows the expansion
of the laminate to be constrained by a minimum amount of low CTE metal, (6 ppm/oC) further increasing
surface mount reliability.

½ oz. to 2 oz./ft.2 electrodeposited copper, ½ oz. to 1 oz. reverse treated electrodeposited copper or ½ oz.
to 2 oz./ ft.2 rolled copper may be specified as cladding on dielectric thicknesses from 0.005” to 0.125”
(0.13 to 3.18mm). RT/duroid 6002 laminate is also available clad with aluminum, brass, or copper plates and
resistive foils

Fetures of Rogers RT duroid 6002 PCB Material

Excellent high frequency performance
Excellent mechanical and electrical properties
Reliable multi-layer board constructions
Extremely low thermal coefficient of dielectric constant
Excellent dimensional stability
In-plane expansion coefficient matched to copper
Allows for more reliable surface mounted assemblies
Ideal for applications sensitive to temperature change
Excellent dimensional stability
Low Z-axis expansion
Reliable plated through-holes
Low outgassing
Ideal for space applications

Rogers Rogers RT duroid 6002 Material applications

Phased Array Antennas
Ground Based and Airborne Radar Systems
Global Positioning System Antennas
Power Backplanes
High Reliability Complex Multilayer Circuits
Commercial Airline Collision Avoidance
Beam Forming Networks

Rogers RT duroid 6002 PCB Material datasheet

Rogers RT duroid 6002 PCB Material standard thickness

0.010” (0.252mm) +/- 0.0007”
0.020” (0.508mm) +/- 0.0010”
0.030” (0.762mm) +/- 0.0010”
0.060” (1.524mm) +/- 0.0020”
*Additional non-standard thicknesses
available 0.005” – 0.250” in increments of
0.005”

Rogers RT duroid 6002 PCB Material standard size

18” X 12” (457mm X 305mm)
18” X 24” (457mm X 610mm)
*Additional panel sizes available

Rogers RT duroid 6002 PCB Material standard Copper clad

Electrodeposited Copper Foil
½ oz. (18µm) HH/HH
1 oz. (35µm) H1/H1
Rolled Copper Foil
½ oz. (18µm) AH/AH
1 oz. (35µm) A1/A1
*Additional claddings, such as heavy metal, resistive foil and
unclad are available