MAGTREX™ 555 laminate
MAGTREX™ 555 laminate is an industry first low loss laminate with controlledpermeability and permittivity. MAGTREX 555 materials are constructed froma…
What are the uses of pull-up resistors and pull-down resistors?
What are the uses of pull-up resistors and pull-down resistors? Resistors” target=”_blank”>Pull-up resistors and pull-down resistors are commonly used components…
Kappa 438 Laminates
Specifically formulated to have FR-4 matched dielectric constant (Dk),design transition to Kappa 438 laminates will be effortless. Theselaminates also exhibit…
IsoClad laminates
IsoClad laminates are nonwoven fiberglass/PTFEcomposites for use as printed circuit boardsubstrates. The nonwoven reinforcement allowsthese laminates to be used more easily…
DiClad Series Laminates
DiClad® laminates are woven fiberglass/PTFE composite materials for use as printedcircuit board substrates. Precise control of the fiberglass/PTFE ratio, DiClad…
AD Series™ Antenna Materials
The AD Series™ antenna materials from Rogers Corporation are highperformance, specialty materials that are specifically engineered andmanufactured to meet the…
XtremeSpeed™ RO1200™ Series Circuit Materials
XtremeSpeed™ RO1200™ extremely low loss digital circuit materials are ceramic-filledlaminates reinforced with woven fiberglass. These materials are engineered to offerexceptional…
TMM® Thermoset Microwave Materials
TMM® thermoset microwave materials are ceramic, hydrocarbon, thermosetpolymer composites designed for high plated-thru-hole reliability striplineand microstrip applications. TMM laminates are…
TC600™ Laminates
TC600™ woven fiberglass reinforced, ceramic filled, PTFE-based compositefor use as a printed circuit board substrate is designed to provide enhancedheat-transfer…
TC350™ Plus Laminates
TC350™ Plus laminates are ceramic filled PTFE-based woven glass reinforcedcomposite materials providing a cost effective, high performance, thermallyenhanced material for…
TC350™ Laminates
TC350™ fiberglass reinforced, ceramic-filled, PTFE-based composite for printedcircuit board substrates, offers outstanding thermal conductivity to enhanceheat transfer, thereby reducing dielectric…
CU4000™ and CU4000 LoPro® Electrodeposited Copper Foil
Rogers CU4000™ foil is intended for MLB designs using RO4000® cores and prepreg materials requiring foil bonded outer layers. CU4000…
RO4835T laminates
RO4835T™ laminates are 3.3 Dk low loss, spread glass reinforced, ceramicthermoset materials that were designed as inner-layers for use in…
Rogers RO4835 Laminate
Thermoset laminate materials, including FR-4, are affected by oxidation overtime and temperature. This can slightly increase the dielectric constant anddissipation…
RO4830™ thermoset laminates
RO4830™ thermoset laminates are well suited for price-sensitive millimeter waveapplications, such as 76-81 GHz automotive radar sensors, and are a…
