| Andwin MCPCB Technical | Capability | ||
|---|---|---|---|
| Item | Standard | Advanced | |
| Board thickness | Maximum (mm) | 3.0 | 7.0 |
| Panel size | Maximum (mm) | 600x2000 | / |
| Layer count | Aluminum PCB | 1-4 | 8 |
| Copper PCB | 1-2 | / | |
| Thermal Conductivity | Aluminum PCB(w/m.k) | 0.8 to 12.0 | |
| Copper PCB(w/m.k) | 2.0-385 | / | |
| Drilling | Minimum drill diameter (mm) | 1.0 | 0.8 |
| 2 Layer ALPCB Via | 0.3 | / | |
| Lines/spaces | Minimum | 0.2mm/0.2mm | 0.15mm/0.15mm |
| Material | Chao Shun(CCAF)(China) | Yes | / |
| Hua Dian(China) | Yes | / | |
| Chin Shi(TaiWan) | Yes | / | |
| Ventec(TaiWang) | Yes | / | |
| ITEQ(Tai Wan) | Yes | / | |
| ShengYi(China) | Yes | / | |
| Laird(US) | Yes | / | |
| Bergquist(US) | Yes | / | |
| Other brand per customer | Yes | / | |
| Final finishing | HASL Lead Free | Yes | / |
| HASL | Yes | / | |
| ENIG | Yes | / | |
| OSP | Yes | / | |
| Immersion Silver | Yes | / | |
| Immersion Tin | / | YES |
MCPCB CapabilityAndwin Circuits