Reflow refers to the process of heating and cooling the PCB to melt and then solidify the solder paste that is used to attach electronic components to the board.
During the reflow process, the flex PCB is placed in a reflow oven, which heats the board to a specific temperature.
The solder paste on the board then melts and flows, creating a strong bond between the components and the PCB.
Once the solder has solidified, the board is cooled and can be inspected and tested.
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