Reflow refers to the process of heating and cooling the PCB to melt and then solidify the solder paste that is used to attach electronic components to the board.
During the reflow process, the flex PCB is placed in a reflow oven, which heats the board to a specific temperature.
The solder paste on the board then melts and flows, creating a strong bond between the components and the PCB.
Once the solder has solidified, the board is cooled and can be inspected and tested.
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As the demand for electronic devices continues to grow, so does the need for efficient andreliable assembly services. One such service is surface mount technology (SMT) assembly,which has become the preferred method for assembling electronic components onto printedcircuit boards (PCBs). SMT assembly involves placing tiny components, such as resistors, capacitors, andintegrated circuits, onto the surface…
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The loss tangent of Rogers 5880 is an important parameter that determines the dielectric loss of the material. It is a measure of the energy lost as heat when an electromagnetic wave passes through the material. The loss tangent is defined as the ratio of the imaginary part of the dielectric constant to the real…
In today’s fast-paced world, businesses are always looking for ways to improve their operations and increase efficiency.One area where this is particularly important is in manufacturing.With so many different components and processes involved in the production of goods,it can be challenging to keep everything running smoothlyand ensure that products are delivered on time and to…