FPC material: from substrate to shielding
FPC material is a flexible circuit board material with excellent bending resistance, lightness and flexibility. This article will introduce in detail the substrate, connection material, insulation material, adhesive, shielding material and products, protective film, conductive silver glue and FPC special sizing material of FPC material.
Material substrate
The substrate of FPC material is mainly composed of resin and reinforcing material. Among them, the resin mainly includes polyimide (PI), polyester (PET) and polyvinyl chloride (PVC), and the reinforcing material mainly includes glass fiber cloth and polyimide film. The thickness of FPC material is generally between 0.03mm-0.2mm, and its processing accuracy requirements are relatively high. The bending radius is generally not more than 0.05mm.
Connection material
The connection materials in FPC material mainly include pads, insulation layers and circuit connections. Pads are metallized areas used to connect circuit boards and other components, generally made of copper or nickel. The insulation layer is mainly used to isolate signal interference between different circuit layers to ensure the reliability of the circuit board. Circuit connection is to connect the wires between different circuit layers to achieve circuit conduction.
Insulating materials
The insulating materials in FPC materials mainly include thermosetting insulating materials and high-temperature resistant insulating materials. Thermosetting insulating materials have high electrical insulation performance and high temperature resistance. Commonly used ones include polyimide film and melamine film. High-temperature resistant insulating materials can maintain good electrical insulation performance at high temperatures. Commonly used ones include silicone and PET film.
Adhesives
The adhesives in FPC materials are mainly used to bond the layers of circuit boards. Commonly used ones include thermosetting adhesives and UV curing adhesives. Thermosetting adhesives have high bonding strength and temperature resistance, and can maintain stable performance at high temperatures. UV curing adhesives have the characteristics of fast curing and environmental friendliness, and are suitable for bonding high-precision and micro circuit boards.
Shielding materials and products
The shielding materials and products in FPC materials are mainly used to prevent electromagnetic interference and signal leakage. Commonly used ones include conductive cloth and conductive glue. Conductive cloth has good electromagnetic shielding performance and mechanical strength, and can be used to make electromagnetic shielding covers and circuit boards. Conductive glue can bond electromagnetic shielding materials and circuit boards together to achieve electromagnetic shielding and circuit conduction.
Protective film
The protective film in FPC materials is mainly used to protect circuit boards from the influence of the external environment. Commonly used ones include insulating protective film and surface protective film. Insulating protective film can effectively isolate the electrical connection between circuit boards and other components to ensure the reliability of circuits. Surface protective film can prevent circuit boards from mechanical damage and contamination during transportation and use.
Conductive silver glue
The conductive silver glue in FPC materials is mainly used to achieve electrical connection between circuit boards and other components. Commonly used ones include single-component silver glue and two-component silver glue. Single-component silver glue can be quickly cured at room temperature and is suitable for bonding various metal and non-metal materials. Two-component silver glue needs to be mixed and has high bonding strength and temperature resistance. It is suitable for electrical connection in special occasions.
FPC special sizing agent
The sizing agent in FPC materials is mainly used to protect circuit boards and improve their reliability. Commonly used ones include resin, diluent and initiator. Resin is the main component of sizing agent. Commonly used ones include epoxy resin, polyester resin and polyurethane resin, which have high bonding strength and insulation performance. The diluent can reduce the viscosity of the resin, which is beneficial to the coating and penetration of the sizing material. The initiator can promote the curing reaction of the resin and improve the curing speed and reliability of the sizing material.
In short, FPC material, as an advanced circuit board material, has excellent performance and use value, and is widely used in electronics, communications, medical and aerospace fields. Understanding the substrate, connection materials, insulation materials, adhesives, shielding materials and products, protective films, conductive silver glue and special sizing materials of FPC materials will help to better apply and understand FPC materials
