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The Failure Mechanisms Behind Poor Solder Wetting Phenomena
Abstract Poor solder wetting, commonly referred to as “non-wetting” or “dewetting,” is a critical defect in soldering processes that significantly impacts the reliability of electronic assemblies. This paper explores the underlying failure mechanisms contributing to poor solder wetting, including surface contamination, oxidation, intermetallic compound (IMC) formation, flux inefficiency, and thermal profile mismanagement. By analyzing these…
