How does the PCB board control the quality of the electroplated copper layer?

The quality control of the electroplated copper layer of the through-hole PCB circuit board is very important, because the development of the multilayer or laminated board to the direction of high density, high precision and multi-functionality, the bonding force to the copper plating layer, the uniform fineness, and the tensile resistance The requirements for strength and elongation are becoming more and more strict and higher, so the quality control of PCB circuit board plating is particularly important.


In order to ensure the uniformity and consistency of the copper plating on the PCB board, in the high aspect ratio PCB plating process, most of them are assisted by high-quality additives, with appropriate air agitation and cathode movement. Under the condition of low current density, the reaction control area of ​​the electrode in the hole is enlarged, and the effect of the plating additive can be displayed. In addition, the movement of the cathode is very favorable for the improvement of the deep plating ability of the plating solution, and the polarization of the plating member. When the degree is increased, the formation speed of the crystal nucleus and the grain growth speed are mutually compensated during the electrocrystallization process of the plating layer, thereby obtaining a high toughness copper layer.

Of course, the current density is set according to the actual plating area of ​​the PCB to be plated. From the understanding of the original understanding of the plating, the value of the current density must also be related to the main salt concentration of the high acid low copper electrolyte, the solution temperature, the additive content, the degree of agitation and the like.


In short, it is necessary to strictly control the process parameters and process conditions of the electroplated copper to ensure that the thickness of the copper plating layer in the hole meets the technical standards.

Grace Zheng