Monthly Archives: July 2018

In general, the most basic process of designing a board can be divided into the following steps: (1) The design of the circuit schematic: The design of the circuit schematic is mainly the PROTEL099 schematic design system (AdvancedSchematic) to draw a circuit schematic. In this process, we should make [...]

Welded FPC Gold Finger Design Tips Benefits of soldering FPC: FPC soldering saves two board-to-board connectors or saves one Zif plug connector, saving 1-2 bucks. Therefore, on many low-end products, welded FPC is used. The disadvantage is that the welding area is larger than the connector, and the maintenance [...]

PCB circuit board common problems and solutions First, Dark and granular contacts appear on the PCB circuit board PCB boards have dark or small grain joints. Most of them are caused by solder contamination and excessive oxides in the tin. The solder joint structure is too brittle. Be careful [...]

First, the technical requirements of aluminum substrates   The main technical requirements are: Dimensional requirements, including board dimensions and deviations, thickness and deviation, perpendicularity and warpage; appearance, including cracks, scratches, burrs and delamination, aluminum oxide film, etc.; performance, including peel strength, surface resistivity, minimum breakdown voltage, dielectric constant, flammability [...]

How does the PCB board control the quality of the electroplated copper layer? The quality control of the electroplated copper layer of the through-hole PCB circuit board is very important, because the development of the multilayer or laminated board to the direction of high density, high precision and multi-functionality, [...]

Precautions for correcting FPC film deformation related methods 1, the splicing method: Applicable: the film with less dense lines and inconsistent deformation of the film layers; it is especially suitable for the deformation of the solder mask and multilayer power supply ground film; Not applicable: negative film with high [...]

The green color is a solder resist ink. The main components are resin, talcum powder, and pigment, as well as other colors such as red, yellow, black, etc. Green is the most widely used. The answer to this question (why are most of the boards green?) is as follows: [...]

What are the reasons for soldering blistering of circuit boards PCB circuit board soldering and blistering means that the circuit board is separated from the board or copper foil in a high temperature environment (above 250 °C), so that the solder resist and the flow blocking effect are lost. [...]

Being able to apply and produce, and then become a formal and effective product is the ultimate goal of the PCB layout, the work of layout is a paragraph. Then, when laying out, what are the general points that should be paid attention to in order to make the [...]

Reasons for instability of PCB electroless nickel plating solution First, the reason for the instability of electroless nickel plating solution When the gas slowly releases the plating solution from the inside of the plating solution and starts to decompose by itself, the gas is not only released on the [...]