AD Series™ Antenna Materials
What is AD Series™ Antenna Materials ? The AD Series™ antenna materials from Rogers Corporation are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of [...]
XtremeSpeed™ RO1200™ Series Circuit Materials
What is XtremeSpeed™ RO1200™ Series Circuit Materials ? XtremeSpeed™ RO1200™ extremely low loss digital circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional [...]
TMM® Thermoset Microwave Materials
What is TMM® Thermoset Microwave Materials ? TMM® thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications. TMM laminates are available [...]
TC600™ Laminates
What is TC600™ Laminates? TC600™ woven fiberglass reinforced, ceramic filled, PTFE-based composite for use as a printed circuit board substrate is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, [...]
TC350™ Plus Laminates
What is TC350™ Plus Laminates ? TC350™ Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit [...]
TC350™ Laminates
What is TC350™ Laminates ? TC350™ fiberglass reinforced, ceramic-filled, PTFE-based composite for printed circuit board substrates, offers outstanding thermal conductivity to enhance heat transfer, thereby reducing dielectric and insertion loss. [...]
A brief discussion on what is a high-frequency PCB board? What are the high-frequency boards? How to choose?
When processing and testing high-frequency PCB boards and high-frequency antennas, beginners often choose the incorrect high-frequency PCB, resulting in unsatisfactory product results. today Let’s talk briefly, what are the high-frequency PCB boards? how to [...]
CU4000™ and CU4000 LoPro® Electrodeposited Copper Foil
What is Rogers CU4000™ and CU4000 LoPro®Electrodeposited Copper Foil ? Rogers CU4000™ foil is intended for MLB designs using RO4000® cores and prepreg materials requiring foil bonded outer layers. CU4000 [...]
RO4835T laminates
What is RO4835T laminates ? RO4835T™ laminates are 3.3 Dk low loss, spread glass reinforced, ceramic thermoset materials that were designed as inner-layers for use in multilayer board designs, and [...]
RO4835IND™ LoPro Laminate
What is RO4835IND™ LoPro® Laminate ? RO4835INDTM LoPro® thermoset laminates are specially designed for 60-81 GHz short range (<30m) industrial radar applications, where excellent electrical performance and cost-efficiency are equally [...]