TC350™ Plus Laminates

TC350™ Plus laminates are ceramic filled PTFE-based woven glass reinforced
composite materials providing a cost effective, high performance, thermally
enhanced material for the circuit designer. With a thermal conductivity of 1.24W/
mK, this next generation PTFE-based laminate is ideally suited for higher power
microwave and industrial heating applications requiring higher maximum operating
temperatures, low circuit losses, and excellent thermal dissipation within the circuit
board. Additionally, the advanced filler system used enables the composite to
have much improved mechanical drilling performance when compared with other
competitive laminates. This will result in lower manufacturing costs during circuit
board fabrication.

The standard TC350 Plus laminates are offered with a smooth (Rq = 1.0µm)
electrodeposited copper foil cladding to reduce insertion loss and RF heating of
conductors within the circuit. Resistive foil and metal plate options are available upon
request. TC350 Plus laminates are available in thicknesses from 0.010” to 0.060” to
address higher power design needs.

The woven glass reinforcement combined with the high filler content of the laminate
affords excellent dimensional stability. Other key features of the laminate include low
z-axis CTE (38ppm/°C) for excellent plated through hole reliability, low loss tangent
of 0.0017 at 10 GHz to enable low loss designs, low moisture absorption of 0.05%
to ensure stable performance in a range of operating environments, high dielectric
strength of 650 V/mil to ensure good z-axis insulation between conductor layers, and
UL 94 V-0 flammability performance to enable the use of the material in commercial

TC350 Plus laminates are used in a range of applications including Amplifiers,
Combiners, Power Dividers, Couplers, and Filters. Applicable markets range from
Commercial and Consumer to Defense and Aerospace

Fetures of TC350™ Plus Laminates

• High Thermal Conductivity of 1.24 W/(m.K)
• Improved Thermal Dissipation
Enabling Lower Operating
Temperatures for High Power
Low Loss Tangent of 0.0017 at 10 GHz
• Excellent High Frequency
Very Low Profile and Thermally Stable
ED Copper Foil (Rq = 1.0 µm)
• Very Low Insertion Loss and
Reduced RF Heat Generation of
Advanced Filler Systems
• Improved Drilling Performance
When Compared to Competitive

TC350™ Plus Laminates applications

• High Power RF and Microwave
Power Amplifiers
• High Power Amplifiers
for Industrial Heating
• Passive Components such as
Couplers, Filters and Power

TC350™ Plus Laminates datasheet

TC350™ Plus Laminates standard thickness

0.010” (0.252mm) +/- 0.0007”
0.020” (0.508 mm) +/- 0.0015”
0.030” (0.762 mm) +/- 0.0020”
0.060” (1.524 mm) +/- 0.0030”
*Additional non-standard thicknesses available from 0.010” –
0.060” in increments of 0.005”

TC350™ Plus Laminates standard size

12” X 18” (305mm X 457mm)
24” X 18” (610mm X 457mm
*Additional panel sizes available

RTC350™ Plus Laminates  standard Copper clad

Reverse Treated Electrodeposited Copper Foil
½ oz. (18μm) SH/SH
1 oz. (35μm) S1/S1
*Additional cladding weights are available

TC350™ Plus Laminates price

TC350™ Plus Laminates price is very high, from 100 to 600 USD/sheet,

The price depend on the rogers  3035 substrate thickness,copper thickness,
Rogers  TC350™ Plus Laminates substrate size etc.

Andwin use TC350™ Plus Laminates to make mass PCB production,
Many types TC350™ Plus Laminates are in stock,also, have good offer from Rogers factory.
If you need TC350™ Plus Laminates or raw material,
Please contact us to get the supper good TC350™ Plus Laminates price.

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