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Resistor – the basic failure model

Resistor - the basic failure model Resistor common failure mode: Resistors due to the structure is relatively simple, mature technology, the failure rate is usually relatively low. Failure of the main performance of the following: Resistance drift: usually occurs after aging; (screening by aging test to avoid the problem) [...]

Resistor – the basic failure model <span class="sdata2" title="2018-01-17T16:59:56+00:00"></span>

From the perspective of demand to understand embedded Linux bus, device and driver

From the perspective of demand to understand embedded Linux: bus, device and driver Modern electronic devices are operating in complex electromagnetic environments. In view of the electromagnetic interference often lead to the electronic equipment failure or even the safety accident, discusses the electromagnetic compatibility design of the electronic system. [...]

From the perspective of demand to understand embedded Linux bus, device and driver <span class="sdata2" title="2018-01-15T14:28:19+00:00"></span>

High-frequency circuit design and wiring is the key to share ten experiences

High-frequency circuit design and wiring is the key to share ten experiences   If the digital logic circuit frequency reaches or exceeds 45MHZ ~ 50MHZ, and work in this frequency circuit has accounted for a certain amount of the entire electronic system (for example, 1/3), usually called high-frequency circuit. [...]

High-frequency circuit design and wiring is the key to share ten experiences <span class="sdata2" title="2018-01-12T18:45:40+00:00"></span>

Why should the PCB board paste gold

Why should the PCB board "paste gold" 01 PCB board surface treatment Anti-oxidation, spray tin, lead-free spray tin, immersion gold, Shen tin, Shen silver, hard gold plating, the whole board gold-plated, Goldfinger, nickel palladium Gold OSP: the cost of the end, good solderability, storage conditions harsh, time Short, environmentally [...]

Why should the PCB board paste gold <span class="sdata2" title="2018-01-10T10:52:49+00:00"></span>

Drill dirt and etch back to Rigid printed circuit board

Drill dirt and etch back to Rigid printed circuit board 1, Overview   Drilling and denting is just an important step after CNC Drilling of PCBs, electroless copper plating or direct copper plating. To achieve a reliable electrical interconnection with flex-printed circuit boards, it is necessary to combine Just [...]

Drill dirt and etch back to Rigid printed circuit board <span class="sdata2" title="2018-01-09T14:33:57+00:00"></span>

How to prevent PCB warpage

How to prevent PCB warpage   Warping circuit boards can cause misalignment of the components. When the circuit board is bent at SMT or THT, the components and pins are not full, which will bring a lot of difficulties to the assembly and installation work. IPC-6012, SMB - SMT [...]

How to prevent PCB warpage <span class="sdata2" title="2018-01-05T14:20:09+00:00"></span>

PCB plating process knowledge data

PCB plating process knowledge data First. Electroplating process classification: Acid Bright Copper Plating Nickel / Gold Plating Tin Second. Process: Pickling → full plate copper plating → graphic transfer → acid degreasing → secondary countercurrent rinsing → micro-etching → secondary → pickling → tin → secondary countercurrent rinsing Countercurrent [...]

PCB plating process knowledge data <span class="sdata2" title="2018-01-04T17:58:12+00:00"></span>

Reasons of PCB Size Fluctuation and Corresponding Analysis

Reasons of PCB Size Fluctuation and Corresponding Analysis From the substrate once the inner layer of the line pattern transfer by several times until the outer layer of the lamination line graphics processing, will cause the puzzle warp and weft to different expansion. From the entire PCB production FLOW-CHART [...]

Reasons of PCB Size Fluctuation and Corresponding Analysis <span class="sdata2" title="2017-12-29T15:24:04+00:00"></span>

FR4 PCB Boards

            Features FR-4 epoxy fiberglass fabric plate, is a kind of substrate with epoxy resin as binder and electronic grade glass fiber cloth as reinforcing material. Its adhesive sheet and thin copper clad laminate are important substrates for making multilayer printed circuit boards. The [...]

FR4 PCB Boards <span class="sdata2" title="2017-12-28T10:58:37+00:00"></span>

PCB laminate production process

PCB laminate production process 1, Autoclave pressure cooker Is a container filled with high temperature saturated water vapor and high pressure. The laminated Laminates can be placed in it for a period of time to force moisture to enter the plate, and the plate removed Placed in a high [...]

PCB laminate production process <span class="sdata2" title="2017-12-28T10:37:21+00:00"></span>

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