RO4450F™ and RO4460G2™

The RO4400™ bondply family is comprised of several grades
based on the RO4000 series core materials, and are compatible
in multi-layer constructions with RO4000 laminates. A high
postcure Tg makes RO4400 series bondply an excellent choice for
multi-layers requiring sequential laminations as fully cured RO4400
bondplys are capable of handling multiple lamination cycles. In
addition, FR-4 compatible bond requirements permit RO4400
bondply and low flow FR-4 bondply to be combined into
non-homogeneous multi-layer constructions using a single bond

RO4450F™ bondply has demonstrated improvement
in lateral flow capability and is becoming the first choice for
new designs or as a replacement in designs that have difficult
fill requirements. RO4460G2™ bondply provides designers with
a 6.15 Dk bonding layer that, just as the other RO4400 bonding
materials, exhibits excellent Dk control while maintaining a
low z axis expansion for plated through hole reliability. Each of
the bondplys are recognized by Underwriter Laboratories with
the UL 94 V-0 flame rating, and are compatible with lead-free

Fetures of RO4450F™ and RO4460G2™ PCB Material

  • Prepreg grades based on RO4000 series core materials
  • Compatible in mulitlayer board
  • constructions with RO4003C,RO4350B, RO4835, RO4350G2,
    and RO4000 LoPro laminates
  • Low z-axis coefficient of thermal expansion ranging from 43 to 60
  • CAF resistant
  • Sequential lamination capable
  •  High frequency thermoset
  • prepreg compatible with FR-4
  • bond temperatures
  • Lead free solder processing compatible
  • High reliability plated throughhole

Rogers RO4450F™ and RO4460G2™ PCB Material applications

• Backhaul Radios
• Communications Systems
• Power Amplifiers
• Small Cells/DAS

Rogers RO4450F™ and RO4460G2™ PCB Material datasheet

Rogers RO4450F™ and RO4460G2™ Material standard thickness

0.0040” (0.102 mm) +/- 0.0006”
*Contact Customer Service or Sales Engineering to inquire
about additional available product configurations

Rogers RO4450F™ and RO4460G2™ Material standard size

16” X 18” (406 X 457mm)
24” X 18” (610 X 457mm)
24.5” X 18.5” (622 X 470mm)
24” X 36” (610 X 915 mm)
*Additional panel sizes available

Rogers RO3010 PCB Material standard Copper clad

Electrodeposited Copper Foil
½ oz. (18μm)
1 oz. (35μm)

Rogers RO4450F™ and RO4460G2™ PCB Raw Material price

Rogers RO4450F™ and RO4460G2™ price are very high, from 100 to 600 USD/sheet,

The price depend on the rogers  3035 substrate thickness,copper thickness,RO4450F™ and RO4460G2™ substrate size etc.

Andwin use Rogers RO4450F™ and RO4460G2™to make mass PCB production,
Many types Rogers RO4450F™ and RO4460G2™ are in stock,also, have good offer from Rogers factory.
If you need Rogers RO4450F™ and RO4460G2™ or raw material,
Please contact us to get the supper good RogersRO4450F™ and RO4460G2™ price.


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