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HDI PCB – High Density Interconnect PCB

High Density Interconnects (HDI) are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation).

HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.

They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards.


Andwin maintains years of experience with HDI products and was a pioneer of second generation microvias. now offer an entire family of microvia technology solutions for your next generation products.

Stack up of HDI PCB


Stack up of 1  Step HDI PCB


Stack up of 2 step HDI PCB


Stack up of  2 steps HDI with blind via and buried viahdi-stack-up-3

Anylayer connect of HDI PCB, need to adjust drillany-layer-connect-hdi-stack-up



  • Cell phone
  • PDA
  • UMPC
  • DSC
  • Camcorder
  • Portable game console


HDI PCB Capabilities

Layers3 - 50 Layers
HDI Step3+N+3
Min.Line Width0.05mm (2 mil)
Min.Line Space0.05mm (2 mil)
Min.Annular ring0.1mm (4 mil)
Min. Via0.1mm (4 mil)
Max.Size500mm X 800mm
MaterialFR4,High Tg220
Material thicknessStart at 25um Plus copper
Copper thickness0.3 OZ to 10 OZ (10um - 350um)


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