HDI PCB – High Density Interconnect PCB
High Density Interconnects (HDI) are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation).
They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards.
Andwin maintains years of experience with HDI products and was a pioneer of second generation microvias. now offer an entire family of microvia technology solutions for your next generation products.
Stack up of HDI PCB
Stack up of 1 Step HDI PCB
Stack up of 2 step HDI PCB
- Cell phone
- Portable game console
HDI PCB Capabilities
|Layers||3 - 50 Layers|
|Min.Line Width||0.05mm (2 mil)|
|Min.Line Space||0.05mm (2 mil)|
|Min.Annular ring||0.1mm (4 mil)|
|Min. Via||0.1mm (4 mil)|
|Max.Size||500mm X 800mm|
|Material thickness||Start at 25um Plus copper|
|Copper thickness||0.3 OZ to 10 OZ (10um - 350um)|