HDI PCB <span class="sdata2" title="2018-01-04T07:43:17+00:00"></span>


Fast HDI PCB prototype Manufacturing , small batch to production

HDI PCB – High Density Interconnect PCB

High Density Interconnects (HDI) are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation).

HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.

They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards.


Andwin maintains years of experience with HDI products and was a pioneer of second generation microvias. now offer an entire family of microvia technology solutions for your next generation products.

Stack up of HDI PCB


Stack up of 1  Step HDI PCB

1 step HDI that need one lamination process,
the most like common PCB board,
after lamination ,laser drill out layer to sub out layer.

Stack up of 2 step HDI PCB

2 step HDI , it need twice lamination process with blind buried hole,
for example,a 6 Layers HDI PCB ,
first time, laminate L2 to L4 layer board ,
then laser drill L2-L3 or/and L4-L5,
and then finish other process.



Stack up of  3 steps HDI with blind via and buried via

3 or 4 step HDI process is similarly 1 or 2 steps ,
only differenci is that need more times lamination.

Anylayer connect of HDI printed circuit board

This type HDI design , need to adjust lamination stack up as normal symmetrical by our Engineer ,
but do not affect the orignal eletronical connect.
it is complex , depend on the orignal design of PCB.


HDI PCB Sample

hdi pcb

8 Layers HDI PCB

Application:  Pad
Layers: 6
Stack: 1+4+1
Thickness: 1.6 mm
Min.track Space/width: 4mil /4mill
Min. CNC Via size: 0.2mm
Laser drill : 0.1mm



  • Cell phone
  • PDA
  • UMPC
  • DSC
  • Camcorder
  • Portable game console


HDI PCB Capabilities

Layers4 - 48 Layers
HDI Step4+N+4
Min.Line Width0.05mm (2 mil)
Min.Line Space0.05mm (2 mil)
Min.Annular ring0.1mm (4 mil)
Min. Via0.1mm (4 mil)
Max.Size500mm X 800mm
MaterialFR4,High Tg220
Material thicknessStart at 25um Plus copper
Copper thickness0.3 OZ to 10 OZ (10um - 350um)

Please send Gerber file for quotation today
Email: sales@andwinpcb.com 

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