TMM® Thermoset Microwave Materials
TMM® thermoset microwave materials are ceramic, hydrocarbon, thermoset
polymer composites designed for high plated-thru-hole reliability stripline
and microstrip applications. TMM laminates are available in a wide range of
dielectric constants and claddings.
The electrical and mechanical properties of TMM laminates combine many of
the benefits of both ceramic and traditional PTFE microwave circuit laminates,
without requiring the specialized production techniques common to these
materials. TMM laminates do not require a sodium napthanate treatment prior
to electroless plating.
TMM laminates have an exceptionally low thermal coefficient of dielectric
constant, typically less than 30 ppm/°C. The material’s isotropic coefficients of
thermal expansion, very closely matched to copper, allow for production of high
reliability plated through holes, and low etch shrinkage values. Furthermore, the
thermal conductivity of TMM laminates is approximately twice that of traditional
PTFE/ceramic laminates, facilitating heat removal.
TMM laminates are based on thermoset resins, and do not soften when heated.
As a result, wire bonding of component leads to circuit traces can be performed
without concerns of pad lifting or substrate deformation.
TMM laminates combine many of the desirable features of ceramic substrates
with the ease of soft substrate processing techniques. TMM laminates are
available clad with 1/2 oz/ft2
to 2 oz/ ft2 electrodeposited copper foil, or bonded
directly to brass or aluminum plates. Substrate thicknesses of 0.015” to 0.500” are
available. The base substrate is resistant to etchants and solvents used in printed
circuit production. Consequently, all common PWB processes can be used to
produce TMM thermoset microwave materials.
Fetures of TMM® Thermoset Microwave Materials
Wide range of dielectric constants
• Ideal for single material systems on a
wide variety of applications
Exceptional mechanical properties
• Resist creep and cold flow
Coefficient of thermal expansion matched
to copper
• High reliability of plated through holes
Resistant to process chemicals
• Reduces damage to material during
fabrication and assembly processes
Thermoset resin
• Reliable wirebonding
• No specialized production
techniques required
• TMM10 and 10i laminates can
replace alumina substrates
TMM® Thermoset Microwave Materials applications
• RF and microwave circuitry
• Power amplifiers and combiners
• Filters and coupler
• Satellite communication systems
• Global Positioning Systems Antennas
• Patch Antennas
• Dielectric polarizers and lenses
• Chip testers
TMM® Thermoset Microwave Materials datasheet
TMM® Thermoset Microwave Materials standard thickness
0.015” (0.381mm) +/- 0.0015”
0.025” (0.635mm) +/- 0.0015”
0.030” (0.762mm) +/- 0.0015”
0.050” (1.270mm) +/- 0.0015”
0.060” (1.524mm) +/- 0.0015”
0.075” (1.900mm) +/- 0.0015”
0.100” (2.500mm) +/- 0.0015”
0.125” (3.175mm) +/- 0.0015”
0.150” (3.810mm) +/- 0.0015”
0.200” (5.080mm) +/- 0.0015”
0.250” (6.350mm) +/- 0.0015”
0.500” (12.70mm) +/- 0.0015”
TMM® Thermoset Microwave Materials standard size
18” X 12” (457mm X 305mm)
18” X 24” (457mm X 610mm)
TMM® Thermoset Microwave Materials standard Copper clad
Electrodeposited Copper Foil
½ oz. (18µm) HH/HH
1 oz. (35µm) H1/H1
*Additional claddings such as heavy
metal and unclad are available
TMM® Thermoset Microwave Materials price
TMM® Thermoset Microwave Materials price is very high, from 100 to 600 USD/sheet,
The price depend on the rogers 3035 substrate thickness,copper thickness,
TMM® Thermoset Microwave Materials substrate size etc.
Andwin useTMM® Thermoset Microwave Materials to make mass PCB production,
Many types TMM® Thermoset Microwave Materials are in stock,also, have good offer from Rogers factory.
If you needTMM® Thermoset Microwave Materials or raw material,
Please contact us to get the supper good TMM® Thermoset Microwave Materials price.
