Monthly Archives: October 2018

Introduction to PCB double-sided reflow process (SMT) Circuit board assembly technology, now popular in the industry is full-board reflow soldering (Reflow), this technology can be divided into single-panel reflow and double-panel reflow. Single-sided reflow is used less because double-sided reflow saves board space. Double-sided reflow requires two reflows. Because [...]

Analysis of the pcb soldering defects There are three main factors that cause pcb soldering defects: First, the solderability of the hole affects the pcb soldering quality Circuit board hole solderability is not good, will produce solder defects, affecting the circuit components of the parameters, resulting in multi-layer board [...]

After the wiring design is completed, it is necessary to carefully check whether the wiring design meets the rules set by the designer, and also needs to confirm the formulation. Whether the rules meet the requirements of the printed board production process, the general inspection has the following aspects: [...]

The difference and advantages and disadvantages of gold plating and immersion gold process (1) Why use gold-plated plates As ICs become more integrated, the IC pins are more dense. The vertical tin-spraying process is difficult to flatten the fine pads, which makes the placement of the SMT difficult; in [...]

Many PCB board design enthusiasts, especially beginners, are not very familiar with the various layers of PCB design. I don't know the role and usage. Here is a systematic explanation for everyone: Mechanical layer As the name suggests, it is the appearance of the entire PCB board. In fact, [...]