XtremeSpeed™ RO1200™ Series Circuit Materials
XtremeSpeed™ RO1200™ extremely low loss digital circuit materials are ceramic-filledlaminates reinforced with woven fiberglass. These materials are engineered to offerexceptional…
TMM® Thermoset Microwave Materials
TMM® thermoset microwave materials are ceramic, hydrocarbon, thermosetpolymer composites designed for high plated-thru-hole reliability striplineand microstrip applications. TMM laminates are…
TC600™ Laminates
TC600™ woven fiberglass reinforced, ceramic filled, PTFE-based compositefor use as a printed circuit board substrate is designed to provide enhancedheat-transfer…
TC350™ Plus Laminates
TC350™ Plus laminates are ceramic filled PTFE-based woven glass reinforcedcomposite materials providing a cost effective, high performance, thermallyenhanced material for…
TC350™ Laminates
TC350™ fiberglass reinforced, ceramic-filled, PTFE-based composite for printedcircuit board substrates, offers outstanding thermal conductivity to enhanceheat transfer, thereby reducing dielectric…
CU4000™ and CU4000 LoPro® Electrodeposited Copper Foil
Rogers CU4000™ foil is intended for MLB designs using RO4000® cores and prepreg materials requiring foil bonded outer layers. CU4000…
RO4835T laminates
RO4835T™ laminates are 3.3 Dk low loss, spread glass reinforced, ceramicthermoset materials that were designed as inner-layers for use in…
Rogers RO4835 Laminate
Thermoset laminate materials, including FR-4, are affected by oxidation overtime and temperature. This can slightly increase the dielectric constant anddissipation…
RO4830™ thermoset laminates
RO4830™ thermoset laminates are well suited for price-sensitive millimeter waveapplications, such as 76-81 GHz automotive radar sensors, and are a…
RO4700™ series antenna grade laminates
RO4700™ series antenna grade laminates are a reliable alternative to the conventional PTFEbased laminates. RO4725JXR™ and RO4730G3(TM) laminates have the…
RO4500™ Series High Frequency Laminatesor
RO4500™ Series High Frequency Laminates are cost/performance materials from RogersCorporation, specifically engineered and manufactured to meet the specific demands ofthe…
RO4450F™ and RO4460G2™
The RO4400™ bondply family is comprised of several gradesbased on the RO4000 series core materials, and are compatiblein multi-layer constructions…
Rogers RO4360G2 PCB material
RO4360G2™ laminates are 6.15 Dk, low loss, glass-reinforced,hydrocarbon ceramic-filled thermoset materials that provide the idealbalance of performance and processing ease….
RT duroid 6202PR high frequency circuit material
RT duroid 6202PR high frequency circuit material is a low loss and low dielectricconstant laminate offering superior electrical and mechanical…
RT duroid 6202 high frequency circuit material
RT duroid 6202 high frequency circuit material is alow loss and low dielectric constant laminate offeringsuperior electrical and mechanical properties…
